PSA at SC19

posted in: Events, PSA News

SC19 or Supercomputing 2019, is the international conference for high performance computing, networking, storage and analysis held in Denver, Colorado, from 18-21 November. The PSA showcased our specifications and reference designs for a board-mounted solution (‘power stamps’) for power conversion … Read More

PSA at OCP Global Summit 2019

posted in: PSA News

The Power Stamp Alliance will be represented at the OCP Global Summit 2019 by its Founding Members, Artesyn Embedded Technologies, Bel Power Solutions, Flex, and STMicroelectronics.

Power Stamp Alliance Announces ASIC Reference Design Board

posted in: PSA News

[March 7, 2019] – The Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters, today announced a new reference design board for high-current ASIC and/or FPGA chipsets supporting the SVID or AVS protocols. PSA … Read More

PSA at CES 2019

posted in: PSA News

While the CES 2019 trade show was in Las Vegas, the Power Stamp Alliance showcased its first reference design board and sample modules from member companies.

New Orcad Library and Allegro Footprint Package

posted in: PSA News

The Power Stamp Alliance (PSA) has added a new Orcad Library and Allegro Footprint Package (Macro) to its website to enable designers to embed Power Stamps into their own schematic, along with the linked Allegro reference footprint for proper layout. … Read More