Power Stamp Alliance Announces New Specification for Controller Stamp

[March 14, 2019] – At the OCP Summit 2019, the Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters, today published a new specification for a controller stamp that will improve the usability of … Read More

Power Stamp Alliance Announces Reference Design Board for Next-Generation 10nm Intel CPU Microarchitecture

[March 14, 2019] – At the OCP Summit 2019, the Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters, today announced a new reference design board for processors based on the next-generation 10 nm … Read More

PSA at OCP Global Summit 2019

The Power Stamp Alliance will be represented at the OCP Global Summit 2019 by its Founding Members, Artesyn Embedded Technologies, Bel Power Solutions, Flex, and STMicroelectronics.

Power Stamp Alliance Announces ASIC Reference Design Board

[March 7, 2019] – The Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters, today announced a new reference design board for high-current ASIC and/or FPGA chipsets supporting the SVID or AVS protocols. PSA … Read More

Power Stamp Alliance Announces Power Industry’s First Company-Neutral Software User Interface

PSA Power Master GUI Can Configure and Control Power Stamps from Multiple Companies [February 7, 2019] – The Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters, today announced a software user interface that … Read More

PSA at CES 2019

While the CES 2019 trade show was in Las Vegas, the Power Stamp Alliance showcased its first reference design board and sample modules from member companies.

New Orcad Library and Allegro Footprint Package

The Power Stamp Alliance (PSA) has added a new Orcad Library and Allegro Footprint Package (Macro) to its website to enable designers to embed Power Stamps into their own schematic, along with the linked Allegro reference footprint for proper layout. … Read More

Power Industry Leaders Create Alliance for 48V Direct Conversion Applications

Artesyn Embedded Technologies, Bel Power Solutions, Flex, and STMicroelectronics Form Power Stamp Alliance to Enable Multi-Vendor Supply-Chain Ecosystem for Open Compute and Data-Center Projects San Jose, Calif. – [March 20, 2018] – At the Open Compute U.S. Summit 2018 today, … Read More

Open Compute Summit 2018

The Power Stamp Alliance will officially launch at the Open Compute Project (OCP) U.S. Summit 2018, to be held March 20th – 21st at the San Jose Convention Center, San Jose, CA, with a presence in each booth of its … Read More